Intel 845MP Mobile Chipset
Intel® 845MP/845MZ Chipset
The Intel® 845MP and Intel® 845MZ chipsets are designed, validated and optimized for the Mobile Intel® Pentium® 4 Processor - M. The Intel® 845MP Chipset supports external graphics and Intel® 845MZ Chipset is optimized for value systems. These platforms deliver the benefits of Intel® quality, reliability and stability that businesses need to deploy mobile computers with maximum ROI and performance headroom for the future. The ICH3-M (82801 CAM I/O Controller Hub 3) makes a direct connection to 845MP/MZ for smoother and faster access to peripherals, providing more benefit for extended PC usage models. Additionally, the chipset uses Intel's advanced mBGA packaging and supports 6 USB ports.
Features and benefits
400MHz System Bus: Delivers a high-bandwidth connection between the Mobile Intel® Pentium® 4 processor - M and the platform
Intel® I/O Hub architecture: Provides a high bandwidth (266MB/s) I/O pipe that delivers fast communications and reduces latency time for I/O operations.
DDR 200/266 MHz SDRAM: Choice of memory technology to support a full range of price/performance requirements up to 1GB. DDR memory offers high reliability and consumes minimal power, critical to the mobile PC platform
AGP4X interface: Provide the most advanced graphics support available, enabling over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D, and video streams
Enhanced Intel Speedstep® Technology: Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life
Deeper Sleep Alert State: New dynamic power management mode operates at 66% lower voltage than Deep sleep mode for longer battery life
Advanced Power Management: Supports ACPI 2.0 compliant for the latest power management and legacy power management with APM 1.2 compliant.
Ultra ATA/100: Takes advantage of the latest industry innovations in HDD features and performance
Latest AC97 Controller: Excellent audio quality, with up to six channels for full surround sound capability including a simultaneous modem connection
Thin & Small Package Technology: Intel® 845MP/MZ chipset uses Intel's most advanced Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability.
Informations take from the Intel® website